E21G - GREEN PLATING TAPE
LTI E21G is a polyester film backing with silicone base adhesive that will conform with high density printed circuit pattern boards to provide a superior straight cut off line for gold contact point, after the process it can be removed without leaving residue and excellent solvent resistance.
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Properties
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Units
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Specifications
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Total Thickness
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μm
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65 ± 5%
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Backing Thickness
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μm
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25± 5%
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Polyester Film
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Adhesive
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Silicone
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Adhesion to Steel
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kg/25mm
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0.70 ↑
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Tack
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Ball No.
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9↑
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Holding Power
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Hour
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24↑
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Temperature Range
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oC
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(-10)~180
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Shelf Life is 12 months with storage condition of 23oC,65%R.H.
- High conformity
- Excellent solvent resistance
- Resistance to high temperature (180oC)
- Compliance to RoSH Report
Designed for masking printed circuit boards to resist high temp (180oC) and plating both chemicals during tin/lead stripping and precious metal such as gold or rhodium plating of finger contacts. Other application like splicing of silicone release coated paper, silicone rubber, textile process.